Display device and method of providing the same

ABSTRACT

A display device includes a display panel, a circuit board, a first conductive film, first and second lower films, and first and second adhesive layers. The display panel includes a display area and a pad area which includes a first pad part. The circuit board is attached on the display panel and includes a lead part overlapping the first pad part. The first conductive film is between the display panel and the circuit board and electrically connects the first pad part and the lead part to each other. The first and second lower films are attached to the display panel to respectively correspond to the display area and the pad area. A thickness of the second adhesive layer between the display panel and the second lower film is less than a thickness of the first adhesive layer between the display panel and the first lower film.

This application claims priority to Korean Patent Application No.10-2021-0087977, filed on Jul. 5, 2021, and all the benefits accruingtherefrom under 35 U.S.C. § 119, which is hereby incorporated byreference for all purposes as if fully set forth herein.

BACKGROUND 1. Field

Embodiments of the invention relate to a display device and method ofmanufacturing (or providing) the same. More particularly, embodiments ofthe invention relate to a flexible display device and method ofmanufacturing (or providing) the same.

2. Description of the Related Art

Flat panel display devices are replacing cathode ray tube displaydevices as display devices due to their lightweight and thincharacteristics. As representative examples of such flat panel displaydevices, there are liquid crystal display devices and organic lightemitting element display devices.

At least a portion of the display device may be bent. Therefore, avisibility of the display device from various angles may be improved,and an area of a non-display region of the display device may bedecreased. In a method of manufacturing (or providing) the displaydevice in which at least a portion thereof is bendable, methods forminimizing or reducing damage and manufacturing cost have been studied.

SUMMARY

Embodiments provide a display device with improved reliability.

Embodiments also provide a method of manufacturing (or providing) thedisplay device with improved reliability.

Additional features of the invention will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the invention.

An embodiment of a display device includes a display panel, a circuitboard, a first conductive film, a first lower film, a second lower film,a first adhesive layer, and a second adhesive layer. The display panelincludes a display area and a pad area which includes a first pad part.The circuit board is in the pad area on the display panel, and includesa lead part overlapping the first pad part. The first conductive film isbetween the display panel and the circuit board, and electricallyconnects the first pad part and the lead part to each other. The firstlower film is attached under the display panel to correspond to thedisplay area. The second lower film is attached under the display panelto correspond to the pad area. The first adhesive layer is between thedisplay panel and the first lower film, and has a first thickness. Thesecond adhesive layer is between the display panel and the second lowerfilm, and has a second thickness less than the first thickness.

In an embodiment, the second adhesive layer may have a uniformthickness.

In an embodiment, the second adhesive layer may include the samematerial as the first adhesive layer.

In an embodiment, the second lower film may be spaced apart from thefirst lower film, and may include a first side surface adjacent to thefirst lower film and a second side surface which is opposite to thefirst side surface. The second adhesive layer may be spaced apart fromthe first adhesive layer, and may include a first side surface adjacentto the first adhesive layer and a second side surface which is oppositeto the first side surface of the second adhesive layer.

In an embodiment, the first side surface of the second adhesive layermay protrude toward the first adhesive layer from the first side surfaceof the second lower film.

In an embodiment, the first side surface of the second adhesive layermay be curved.

In an embodiment, the second side surface of the second adhesive layermay be aligned with the second side surface of the second lower film.

In an embodiment, the second side surface of the second adhesive layermay be flat.

In an embodiment, the display panel may further include a second padpart in the pad area to be spaced apart from the first pad part. Thedisplay device may further include a driving circuit chip and a secondconductive film. The driving circuit chip may be in the pad area on thedisplay panel to be spaced apart from the circuit board, and may includea bump part overlapping the second pad part. The second conductive filmmay be between the display panel and the driving circuit chip, and mayelectrically connect the second pad part and the bump part to eachother.

An embodiment of a method of providing a display device includes a firstpressing step, a first attaching step, and a second pressing step. Inthe first pressing step, a pad area of a display module is pressed. Thedisplay module includes a display panel, a first lower film, a secondlower film, a first adhesive layer, and a second adhesive layer. Thedisplay panel includes a display area and the pad area. The first padpart may be in the pad area. The first lower film is attached under thedisplay panel to correspond to the display area. The second lower filmis attached under the display panel to correspond to the pad area. Thefirst adhesive layer is between the display panel and the first lowerfilm, and has a first thickness. The second adhesive layer is betweenthe display panel and the second lower film, and has a thickness thesame as the first thickness. In the first attaching step, a firstconductive film is attached on the first pad part. In the secondpressing step, a circuit board including a lead part is placed on thefirst conductive film, and the circuit board is pressed to electricallyconnect the first pad part and the lead part to each other.

In an embodiment, after the first pressing step, the second adhesivelayer may have a second thickness less than the first thickness.

In an embodiment, after the second pressing step, the second adhesivelayer may have the second thickness.

In an embodiment, after the second pressing step, the second adhesivelayer may have a uniform thickness.

In an embodiment, the display panel may further include a second padpart in the pad area to be spaced apart from the first pad part. Themethod may further include, after the first pressing step, a secondattaching step of attaching a second conductive film on the second padpart, and a third pressing step of placing a driving circuit chipincluding a bump part on the second conductive film and pressing thedriving circuit chip to electrically connecting the second pad part andthe bump part to each other.

In an embodiment, after the third pressing step, the second adhesivelayer may have the second thickness.

In an embodiment, in the second pressing step, the circuit board may bepressed with a first pressure. In the first pressing step, the pad areaof the display module may be pressed with a second pressure equal to orgreater than the first pressure.

In an embodiment, in the second pressing step, the circuit board may bepressed together with heating the pad area of the display module to afirst temperature. In the first pressing step, the pad area of thedisplay module may be pressed together with heating the pad area of thedisplay module to a second temperature equal to or greater than thefirst temperature.

In an embodiment, the method further include, after the first pressingstep, cutting at least a portion of a protrusion of the second adhesivelayer in which the second adhesive layer protrudes from the second lowerfilm.

In an embodiment, in the first pressing step, a portion of the pad areaoverlapping the first pad part may be selectively pressed.

In an embodiment, the circuit board may be disposed in consideration ofan elongation of the display panel by the first pressing step.

The method of providing the display device may include a main-pressingstep for electrically connecting the circuit board and the drivingcircuit chip to the display panel through an anisotropic conductivefilm, and a pre-pressing step performed before the main-pressing step.Accordingly, the adhesive layer in the pad area under the display panelmay have a substantially uniform thickness even after the main-pressingstep. Accordingly, a connection failure due to a massing of conductiveballs in the anisotropic conductive film may be prevented or reduced.Accordingly, a reliability of the display device may be improved.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate embodiments of the invention, andtogether with the description serve to explain the invention.

FIGS. 1 and 2 are plan views illustrating an embodiment of a displaydevice.

FIGS. 3 and 4 are cross-sectional views illustrating the display deviceof FIG. 1 .

FIG. 5 is a cross-sectional view taken along line I-I′ of FIG. 1 .

FIG. 6 is an enlarged cross-sectional view of area ‘A’ of FIG. 3 .

FIG. 7 is a cross-sectional view taken along line II-II′ of FIG. 1 .

FIG. 8 is an enlarged cross-sectional view of area ‘B’ of FIG. 3 .

FIG. 9 is a cross-sectional view taken along line of FIG. 1 .

FIGS. 10 to 15 are cross-sectional views illustrating embodiments ofprocesses in a method of providing the display device of FIG. 1 .

FIG. 16 is a block diagram illustrating an embodiment of an electronicdevice including the display device of FIG. 1 .

FIG. 17 is a diagram illustrating an embodiment of the electronic deviceof FIG. 16 which is implemented as a television.

FIG. 18 is a diagram illustrating an embodiment of the electronic deviceof FIG. 16 which is implemented as a smart phone.

DETAILED DESCRIPTION

The invention now will be described more fully hereinafter withreference to the accompanying drawings, in which various embodiments areshown. This invention may, however, be embodied in many different forms,and should not be construed as limited to the embodiments set forthherein. Rather, these embodiments are provided so that this disclosurewill be thorough and complete, and will fully convey the scope of theinvention to those skilled in the art. Like reference numerals refer tolike elements throughout. As used herein, a reference number mayindicate a singular element or a plurality of the element. For example,a reference number labeling a singular form of an element within thedrawing figures may be used to reference a plurality of the singularelement within the text of specification

It will be understood that when an element is referred to as being “on”another element, it can be directly on the other element or interveningelements may be present therebetween. In contrast, when an element isreferred to as being “directly on” another element, there are nointervening elements present. It will be understood that, although theterms “first,” “second,” “third” etc. may be used herein to describevarious elements, components, regions, layers and/or sections, theseelements, components, regions, layers and/or sections should not belimited by these terms. These terms are only used to distinguish oneelement, component, region, layer or section from another element,component, region, layer or section. Thus, “a first element,”“component,” “region,” “layer” or “section” discussed below could betermed a second element, component, region, layer or section withoutdeparting from the teachings herein.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein,“a”, “an,” “the,” and “at least one” do not denote a limitation ofquantity, and are intended to include both the singular and plural,unless the context clearly indicates otherwise. For example, “anelement” has the same meaning as “at least one element,” unless thecontext clearly indicates otherwise. “At least one” is not to beconstrued as limiting “a” or “an.” “Or” means “and/or.” As used herein,the term “and/or” includes any and all combinations of one or more ofthe associated listed items. It will be further understood that theterms “comprises” and/or “comprising,” or “includes” and/or “including”when used in this specification, specify the presence of statedfeatures, regions, integers, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, regions, integers, steps, operations, elements,components, and/or groups thereof.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother element as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. Forexample, if the device in one of the figures is turned over, elementsdescribed as being on the “lower” side of other elements would then beoriented on “upper” sides of the other elements. The term “lower,” cantherefore, encompasses both an orientation of “lower” and “upper,”depending on the particular orientation of the figure. Similarly, if thedevice in one of the figures is turned over, elements described as“below” or “beneath” other elements would then be oriented “above” theother elements. The terms “below” or “beneath” can, therefore, encompassboth an orientation of above and below.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” can mean within one or morestandard deviations, or within ±30%, 20%, 10% or 5% of the stated value.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Embodiments are described herein with reference to cross sectionillustrations that are schematic illustrations of idealized embodiments.As such, variations from the shapes of the illustrations as a result,for example, of manufacturing techniques and/or tolerances, are to beexpected. Thus, embodiments described herein should not be construed aslimited to the particular shapes of regions as illustrated herein butare to include deviations in shapes that result, for example, frommanufacturing. For example, a region illustrated or described as flatmay, typically, have rough and/or nonlinear features. Moreover, sharpangles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

Illustrative, non-limiting embodiments will be more clearly understoodfrom the following detailed description in conjunction with theaccompanying drawings.

FIGS. 1 and 2 are plan views illustrating embodiments of a displaydevice 10. FIGS. 3 and 4 are cross-sectional views illustrating thedisplay device 10 of FIG. 1 . FIG. 5 is a cross-sectional view takenalong line I-I′ of FIG. 1 . In an embodiment, for example, FIG. 4 mayillustrate a bent configuration of the display device 10 of FIG. 3 .

Referring to FIGS. 1 to 5 , a display device 10 may include a displaypanel 100, a circuit board 200, a driving circuit chip 300, and a lowerfilm.

The display panel 100 may generate or display images. The display panel100 may include a plurality of pixels for generating the image. Lightemitted from each of the pixels may be combined to generate or displayimages. The display panel 100 may provide the generated image toward anupper surface of the display device 10 (e.g., a display surface).

In an embodiment, the display panel 100 may include (or, may have) afirst area 1A, a second area 2A, and a bending area BA. In anembodiment, for example, the second area 2A may be spaced apart from thefirst area 1A in a first direction DR1. The pixels may be disposed inthe first area 1A, and a pad part may be disposed in the second area 2A.In an embodiment, for example, the first area 1A may be referred to as adisplay area, and the second area 2A may be referred to as a pad area.

The first area 1A, the bending area BA and the second area 2A may be inorder along the first direction DR1. The bending area BA may bepositioned between the first area 1A and the second area 2A. The bendingarea BA may be bendable to be bent along a bending axis extending in asecond direction DR2 crossing the first direction DR1. In an embodiment,for example, the second direction DR2 may be perpendicular to the firstdirection DR1.

In an embodiment, as illustrated in FIG. 1 , the first area 1A, thebending area BA, and the second area 2A may have substantially the samewidth in the second direction DR2. That is, the display panel 100 mayhave an overall rectangular shape in a plan view. The display device 10(or the display panel 100) which is flat or unbent, may be disposed in aplane defined by the first direction DR1 and the second direction DR2which cross each other. Various components or layers of the displaydevice 10 may have a first area 1A, a second area 2A, and a bending areaBA corresponding to those described above.

In an embodiment, as illustrated in FIG. 2 , each of a width of thebending area BA and a width of the second area 2A in the seconddirection DR2 may be less than a width of the first area 1A in thesecond direction DR2. In an embodiment, for example, a width of thedisplay panel 100 may be narrowed in a portion of the first area 1Aadjacent to the bending area BA (e.g., a portion which is closest to thebending area BA). In an embodiment, for example, the width of thebending area BA in the second direction DR2 may be substantially thesame as the width of the second area 2A in the second direction DR2.

In an embodiment, the display panel 100 may include a substrate 110, atransistor TR, a light emitting element 150, an encapsulation layer 160,a first pad part 170, and a second pad part 180. The transistor TR andthe light emitting element 150 may be disposed in the first area 1A, onthe substrate 110. The first pad part 170 and the second pad part 180may be disposed in the second area 2A, on the substrate 110.

The substrate 110 may be a flexible and insulating substrate. In anembodiment, for example, the substrate 110 may include (or, may be) atransparent resin substrate. In an embodiment, for example, thesubstrate 110 may include a polyimide substrate. In this case, thesubstrate 110 may have a multi-layered structure in which one or morepolyimide layer and one or more barrier layer are alternately stacked.

An active layer 120 may be disposed on the substrate 110. The activelayer 120 may include an oxide semiconductor, a silicon semiconductor,an organic semiconductor, or the like. In an embodiment, for example,the oxide semiconductor may include at least one oxide of indium (In),gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf),cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc(Zn). The silicon semiconductor may include an amorphous silicon, apolycrystalline silicon, or the like, but embodiments are not limitedthereto. The active layer 120 may include a source area, a drain area,and a channel area which is positioned between the source area and thedrain area.

In an embodiment, a buffer layer (not shown) may be disposed between thesubstrate 110 and the active layer 120. The buffer layer may prevent orreduce instances of impurities diffusing into the active layer 120 fromthe substrate 110. The buffer layer may include an inorganic insulatingmaterial such as a silicon compound, a metal oxide, or the like.Examples of the inorganic insulating material may include silicon oxide(SiO), silicon nitride (SiN), silicon oxynitride (SiON), siliconoxycarbide (SiOC), silicon carbonitride (SiCN), aluminum oxide (AlO),aluminum nitride (AlN), tantalum oxide (TaO), hafnium oxide (HfO),zirconium oxide (ZrO), titanium oxide (TiO), or the like, butembodiments are not limited thereto. These can be used alone or in acombination thereof. The buffer layer may have a single-layeredstructure or a multi-layered structure including a plurality ofinsulating layers.

A first insulating layer 111 may be disposed on the active layer 120.The first insulating layer 111 may cover the active layer 120 on thesubstrate 110. The first insulating layer 111 may include an inorganicinsulating material.

A gate electrode 130 may be disposed on the first insulating layer 111.The gate electrode 130 may overlap (or correspond to) the channel areaof the active layer 120. The gate electrode 130 may include a conductivematerial such as a metal, an alloy, a conductive metal nitride, aconductive metal oxide, a transparent conductive material, or the like.Examples of the conductive material may include gold (Au), silver (Ag),aluminum (Al), platinum (Pt), nickel (Ni), titanium (Ti), palladium(Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr),tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), scandium(Sc), neodymium (Nd), iridium (Ir), alloys containing aluminum, alloyscontaining silver, alloys containing copper, alloys containingmolybdenum, aluminum nitride (AlN), tungsten nitride (WN), titaniumnitride (TiN), chromium nitride (CrN), tantalum nitride (TaN), strontiumruthenium oxide (SrRuO), zinc oxide (ZnO), indium tin oxide (ITO), tinoxide (SnO), indium oxide (InO), gallium oxide (GaO), indium zinc oxide(IZO), or the like, but embodiments are not limited thereto. These canbe used alone or in a combination thereof. The gate electrode 130 mayhave a single-layered structure or a multi-layered structure including aplurality of conductive layers.

A second insulating layer 112 may be disposed on the gate electrode 130.The second insulating layer 112 may cover the gate electrode 130 on thefirst insulating layer 111. The second insulating layer 112 may includean inorganic insulating material.

A source electrode 141 and a drain electrode 142 may be disposed on thesecond insulating layer 112. The source electrode 141 and the drainelectrode 142 may be connected to the source area and the drain area ofthe active layer 120, respectively. Each of the source electrode 141 andthe drain electrode 142 may include a conductive material. In anembodiment, for example, each of the source electrode 141 and the drainelectrode 142 may have a multi-layered structure of Ti/Al/Ti. The activelayer 120, the gate electrode 130, the source electrode 141, and thedrain electrode 142 may together form the transistor TR.

A third insulating layer 113 may be disposed on the source electrode 141and the drain electrode 142. The third insulating layer 113 may includean organic insulating material. Examples of the organic insulatingmaterial may include a photoresist, a polyacryl-based resin, apolyimide-based resin, a polyamide-based resin, a siloxane-based resin,an acryl-based resin, an epoxy-based resin, or the like, but embodimentsare not limited thereto. These can be used alone or in a combinationthereof. In an embodiment, the third insulating layer 113 may have amulti-layered structure including at least one organic insulating layerand at least one inorganic insulating layer.

A pixel electrode 151 may be disposed on the third insulating layer 113.The pixel electrode 151 may include a conductive material. The pixelelectrode 151 may be connected to the drain electrode 142 through acontact hole formed (or defined) in the third insulating layer 113.Accordingly, the pixel electrode 151 may be electrically connected tothe transistor TR.

A fourth insulating layer 114 may be disposed on the pixel electrode151. The fourth insulating layer 114 may cover a peripheral portion ofthe pixel electrode 151, and may define a pixel opening exposing acentral portion of the pixel electrode 151. The fourth insulating layer114 may include an organic insulating material.

An emission layer 152 may be disposed on the pixel electrode 151. Theemission layer 152 may be disposed in the pixel opening of the fourthinsulating layer 114. In some embodiments, the emission layer 152 mayinclude at least one of an organic light emitting material or quantumdot.

In an embodiment, the organic light emitting material may include a lowmolecular organic compound or a high molecular organic compound.Examples of the low molecular organic compound may include copperphthalocyanine, N,N′-diphenylbenzidine,tris-(8-hydroxyquinoline)aluminum, or the like. Examples of the highmolecular organic compound may include poly(3,4-ethylenedioxythiophene),polyaniline, poly-phenylenevinylene, polyfluorene, or the like. Thesecan be used alone or in a combination thereof.

In an embodiment, the quantum dot may include a core including a GroupII-VI compound, a Group III-V compound, a Group IV-VI compound, a GroupIV element, and/or a Group IV compound. In an embodiment, the quantumdot may have a core-shell structure including the core and a shellsurrounding the core. The shell may serve as a protection layer forpreventing the core from being chemically denatured to maintainsemiconductor characteristics, and may serve as a charging layer forimparting electrophoretic characteristics to the quantum dot.

A counter electrode 153 may be disposed on the emission layer 152. Thecounter electrode 153 may also be disposed on the fourth insulatinglayer 114. The counter electrode 153 may include a conductive material.The pixel electrode 151, the emission layer 152, and the counterelectrode 153 may together form the light emitting element 150.

An encapsulation layer 160 may be disposed on the counter electrode 153.The encapsulation layer 160 may include at least one inorganicencapsulation layer and at least one organic encapsulation layer. In anembodiment, the encapsulation layer 160 may include a first inorganicencapsulation layer 161 disposed on the counter electrode 153, anorganic encapsulation layer 162 disposed on the first inorganicencapsulation layer 161, and a second inorganic encapsulation layer 163disposed on the organic encapsulation layer 162.

In an embodiment, a first end portion of the circuit board 200 may beconnected to an end portion (e.g., an end portion in the first directionDR1 or distal end) of the display panel 100. In an embodiment, forexample, the circuit board 200 may be attached to the display panel 100by a first conductive film 410, and may be electrically connected to thefirst pad part 170 of the display panel 100 by the first conductive film410. This will be described later in detail.

The circuit board 200 may be a flexible printed circuit board (FPCB). Aprinted circuit board (PCB) (not illustrated) may be attached on asecond end portion of the circuit board 200 which is opposite to thefirst end portion.

In an embodiment, the driving circuit chip 300 may be disposed in thesecond area 2A, on the display panel 100, to be spaced apart from thecircuit board 200. In an embodiment, for example, the driving circuitchip 300 may be disposed in the second area 2A, on the display panel100, to be spaced apart from the circuit board 200 in a directionopposite to the first direction DR1. That is, the driving circuit chip300 may be directly mounted on the display panel 100 in a chip onplastic (COP) method. In an embodiment, for example, the driving circuitchip 300 may be attached on the display panel 100 by a second conductivefilm 420, and may be electrically connected to the second pad part 180of the display panel 100 by the second conductive film 420. This will bedescribed later in detail.

In an embodiment, the driving circuit chip 300 may be mounted on thecircuit board 200 connected to the display panel 100, in a chip on film(COF) method.

The circuit board 200, the driving circuit chip 300, and the PCB mayprovide a driving signal to the display panel 100. The driving signalmay include various signals (e.g., electrical signals) for driving thedisplay panel 100 such as driving voltage, a gate signal, a data signal,or the like.

The lower film may be disposed under the display panel 100 (e.g., thesubstrate 110) to protect the display panel 100 from external impact.The lower film may be attached to a lower surface of the display panel100 (e.g., the substrate 110) by an adhesive layer. The lower film maybe attached to the display panel 100 at a lower surface of the substrate110, without being limited thereto.

In an embodiment, the lower film may include a first lower film 610 anda second lower film 620 that are spaced apart from each other (e.g.,disconnected from each other at the bending area BA). The first lowerfilm 610 may be attached to the lower surface of the display panel 100to correspond to the first area 1A. The second lower film 620 may beattached to the lower surface of the display panel 100 to correspond tothe second area 2A. That is, the second lower film 620 may be spacedapart from the first lower film 610 in the first direction DR1 with thebending area BA interposed therebetween.

The first lower film 610 and the second lower film 620 may include asubstantially same material. In an embodiment, for example, each of thefirst lower film 610 and the second lower film 620 may include a polymermaterial. Examples of the polymer material may include polyethyleneterephthalate (PET), polyethylene naphthalene (PEN), polypropylene (PP),polycarbonate (PC), polystyrene (PS), polysulfone (PSul), polyethylene(PE), polyphthalamide (PPA), polyethersulfone (PES), polyarylate (PAR),polycarbonate oxide (PCO), modified polyphenylene oxide (MPPO), or thelike, but embodiments are not limited thereto. These can be used aloneor in a combination thereof.

The first lower film 610 may be attached to the lower surface of thedisplay panel 100 by a first adhesive layer 510, and the second lowerfilm 620 may be attached to the lower surface of the display panel 100by a second adhesive layer 520. That is, the first adhesive layer 510may be disposed between the display panel 100 and the first lower film610, and may correspond to the first area 1A. The second adhesive layer520 may be disposed between the display panel 100 and the second lowerfilm 620, and may correspond to the second area 2A. The second adhesivelayer 520 may be spaced apart from the first adhesive layer 510 (e.g.,disconnected from the first adhesive layer 510) in the first directionDR1 with the bending area BA interposed therebetween.

The first adhesive layer 510 and the second adhesive layer 520 mayinclude a substantially same material. In an embodiment, for example,each of the first adhesive layer 510 and the second adhesive layer 520may include (or, may be) a pressure sensitive adhesive (PSA), an opticalclear adhesive (OCA), an optical clear resin (OCR), or the like.

In an embodiment, the first adhesive layer 510 may have a firstthickness T1, and the second adhesive layer 520 may have a secondthickness T2 which is less than the first thickness T1. In anembodiment, for example, the first thickness T1 may mean an averagethickness of the first adhesive layer 510, and the second thickness T2may mean an average thickness of the second adhesive layer 520.

In an embodiment, the second adhesive layer 520 may have a substantiallyuniform thickness.

The second lower film 620 may include (or, may have) a first sidesurface 620 a adjacent to (or closest to) the first lower film 610 and asecond side surface 620 b which is opposite to the first side surface620 a. The second adhesive layer 520 may include (or, may have) a firstside surface 520 a adjacent to or closest to the first adhesive layer510 and a second side surface 520 b which is opposite to the first sidesurface 520 a.

In an embodiment, as illustrated in FIG. 3 , the first side surface 520a of the second adhesive layer 520 may protrude from the first sidesurface 620 a of the second lower film 620 in the direction opposite tothe first direction DR1 (e.g., toward the first adhesive layer 510), todispose the first side surface 520 a of the second adhesive 520 spacedapart from the first side surface 620 a of the second lower film 620.The second adhesive layer 520 may protrude further from the first sidesurface 620 a of the second lower film 620, to define a protrudedportion or protrusion of the second adhesive layer 520. The first sidesurface 520 a of the second adhesive layer 520 may be curved. Incontrast, the second side surface 520 b of the second adhesive layer 520may be aligned with (or coplanar with) the second side surface 620 b ofthe second lower film 620. The second side surface 520 b of the secondadhesive layer 520 may be flat.

In an embodiment, the second side surface 520 b of the second adhesivelayer 520 may protrude from the second side surface 620 b of the secondlower film 620 in the first direction DR1. The second side surface 520 bof the second adhesive layer 520 may be curved.

FIG. 6 is an enlarged cross-sectional view of area ‘A’ of FIG. 3 . FIG.7 is a cross-sectional view taken along line of FIG. 1 .

Referring to FIGS. 1, 3, 6, and 7 , in an embodiment, the first pad part170 disposed in the second area 2A on the substrate 110 may include afirst pad electrode 172 provided in plural including a plurality offirst pad electrodes 172 arranged in the second direction DR2. In anembodiment, for example, each of the first pad electrodes 172 may bedisposed in a same layer as the source electrode 141 and the drainelectrode 142. As used herein, elements which are in a same layer aseach other may be respective patterns of a same material layer on thesubstrate 110, without being limited thereto. In an embodiment, forexample, each of the first pad electrodes 172 may have a multi-layeredstructure of Ti/Al/Ti.

The circuit board 200 may include a first base substrate 210 and a leadpart 220. The lead part 220 may include a lead terminal 222 provided inplural including a plurality of lead terminals 222 arranged in thesecond direction DR2. The circuit board 200 may be attached to thedisplay panel 100 such that the lead part 220 overlaps the first padpart 170.

The first conductive film 410 may be disposed between the display panel100 and the circuit board 200. The first conductive film 410 may includea film layer 412 and a plurality of conductive balls 414. In anembodiment, for example, the first conductive film 410 may be ananisotropic conductive film (ACF).

The first pad part 170 of the display panel 100 and the lead part 220 ofthe circuit board 200 may be electrically connected to each other by thefirst conductive film 410. In an embodiment, for example, the first padelectrodes 172 may be electrically connected to the corresponding onesof the lead terminals 222 by the conductive balls 414, respectively.

In an embodiment, the second adhesive layer 520 may have a substantiallyuniform thickness. In an embodiment, for example, as illustrated in FIG.7 , a thickness T2 a of a first portion of the second adhesive layer 520overlapping each of the first pad electrodes 172 may be substantiallythe same as a thickness T2 b of a second portion of the second adhesivelayer 520 overlapping a first opening OP1 between two adjacent first padelectrodes 172.

FIG. 8 is an enlarged cross-sectional view of area ‘B’ of FIG. 3 . FIG.9 is a cross-sectional view taken along line of FIG. 1 .

Referring to FIGS. 1, 3, 8, and 9 , in an embodiment, the second padpart 180 disposed in the second area 2A, on the substrate 110, mayinclude a second pad electrode 182 provided in plural including aplurality of second pad electrodes 182 arranged in the second directionDR2. The second pad part 180 may be spaced apart from the first pad part170 in the direction opposite to the first direction DR1. In anembodiment, for example, each of the second pad electrodes 182 may bedisposed in a same layer as the source electrode 141 and the drainelectrode 142. In an embodiment, for example, each of the second padelectrodes 182 may have a multi-layered structure of Ti/Al/Ti.

The driving circuit chip 300 may include a second base substrate 310 anda bump part 320. The bump part 320 may include a bump electrode 322provided in plural including a plurality of bump electrodes 322 arrangedin the second direction DR2. The driving circuit chip 300 may beattached to the display panel 100 such that the bump part 320 overlapsthe second pad part 180.

The second conductive film 420 may be disposed between the display panel100 and the driving circuit chip 300. The second conductive film 420 mayinclude a film layer 422 and a plurality of conductive balls 424. In anembedment, for example, the second conductive film 420 may havesubstantially the same configuration as the first conductive film 410.

The second pad part 180 and the bump part 320 may be electricallyconnected to each other by the second conductive film 420. In anembodiment, for example, the second pad electrodes 182 may beelectrically connected to the corresponding ones of the bump electrodes322 by the conductive balls 424, respectively.

In an embodiment, the second adhesive layer 520 may have a substantiallyuniform thickness. In an embodiment, for example, as illustrated in FIG.9 , a thickness T2 c of a third portion of the second adhesive layer 520overlapping each of the second pad electrodes 182 may be substantiallythe same as a thickness T2 d of a fourth portion of the second adhesivelayer 520 overlapping a second opening OP2 between two adjacent secondpad electrodes 182. In an embodiment, for example, the thickness T2 a ofthe first portion of the second adhesive layer 520, the thickness T2 bof the second portion of the second adhesive layer 520, the thickness T2c of the third portion of the second adhesive layer 520, and thethickness T2 d of the fourth portion of the second adhesive layer 520may be substantially the same. Accordingly, a connection failure betweenthe first pad part 170 and the lead part 220 due to a massing of theconductive balls 414 or a connection failure between the second pad part180 and the bump part 320 due to a massing of the conductive balls 424may be prevented or reduced. Accordingly, a reliability of the displaydevice 10 may be improved.

FIGS. 10 to 15 are cross-sectional views illustrating an embodiment of amethod of manufacturing (or providing) the display device 10 of FIG. 1 .

Referring to FIG. 10 , a display module 20 including the display panel100, the first adhesive layer 510, the second adhesive layer 520, thefirst lower film 610, and the second lower film 620 may be prepared. Inan embodiment, for example, the display module 20 may be a semi-finishedproduct of the display device 10. The display panel 100, the firstadhesive layer 510, the second adhesive layer 520, the first lower film610, and the second lower film 620 may be the same as or similar tothose described with reference to FIGS. 1 to 9 , therefore, repeateddescriptions will be omitted or simplified.

In an embodiment, the display module 20 may further include a thirdlower film 630 and a third adhesive layer 530. The third lower film 630may be commonly attached to a lower surface of the first lower film 610and a lower surface of the second lower film 620 by the third adhesivelayer 530 to correspond to an entirety of the first area 1A, the secondarea 2A, and the bending area BA. The third lower film 630 may protectthe display panel 100 from an external impact during a process ofmanufacturing or providing the display device 10, or may maintain ashape of the display module 20. As will be described later, the thirdlower film 630 and the third adhesive layer 530 may be separated fromthe first lower film 610 and the second lower film 620 before thedisplay panel 100 is bent. That is, the third lower film 630 and thethird adhesive layer 530 are removably attached to the first lower film610 and the second lower film 620.

The first adhesive layer 510 and the second adhesive layer 520 mayinclude a substantially same material. The first adhesive layer 510 mayhave a first thickness T1. The second adhesive layer 520 may have athickness T2′ (e.g., preliminary thickness) that is substantially thesame as the first thickness T1.

Referring to FIGS. 10 and 11 , the second area 2A of the display module20 may be pre-pressed using a pressing device 810. The pre-pressing step(e.g., a first pressing step) may be a pressing step for pre-deformingthe second adhesive layer 520 (e.g., deform the second adhesive layer520) before a main-pressing step (e.g., second and third pressing steps)for electrically connecting the circuit board 200 and the drivingcircuit chip 300 to the display panel 100 (in FIG. 13 ).

As described above with reference to FIGS. 6 to 9 , the first pad part170 and the lead part 220 may be electrically connected to each other bythe first conductive film 410, and the second pad part 180 and the bumppart 320 may be electrically connected to each other by the secondconductive film 420. In an embodiment, for example, the first padelectrodes 172 may be electrically connected to the corresponding onesof the lead terminals 222 by the conductive balls 414, respectively. Thesecond pad electrodes 182 may be electrically connected to thecorresponding ones of the bump electrodes 322 by the conductive balls424, respectively. In this case, when each of the first pad electrodes172 and each of the second pad electrodes 182 have a multi-layeredstructure of Ti/Al/Ti, a portion of the upper Ti layer may be easilyoxidized to form an insulating oxide layer (TiO). Therefore, in themain-pressing step, the circuit board 200 and the driving circuit chip300 may be respectively main-pressed with a predetermined pressure(hereinafter, referred to as a first pressure) required for theconductive balls 414 and 424 to break the insulating oxide layer andconnect with the conductive Ti layer, so that the first pad part 170 andthe lead part 220 may be electrically connected and the second pad part180 and the bump part 320 may be electrically connected. In addition,when the film layers 412 and 422 include a thermo-curable resin, in themain-pressing step, the circuit board 200 and the driving circuit chip300 may be respectively main-pressed while heating the second area 2A ofthe display module 20 to a predetermined temperature (hereinafter,referred to as a first temperature) required to cure the film layers 412and 422.

When the main-pressing step is performed without the pre-pressing step,the second adhesive layer 520 under the circuit board 200 may bedeformed. In an embodiment, for example, the second adhesive layer 520may be deformed such that the thickness T2 a of the first portion of thesecond adhesive layer 520 overlapping each of the first pad electrodes172 is less than the thickness T2′ which is before deformation, and thethickness T2 b of the second portion of the second adhesive layer 520overlapping the first opening OP1 between two adjacent first padelectrodes 172 is greater than the thickness T2′ which is beforedeformation. In addition, the second adhesive layer 520 may be deformedsuch that the thickness T2 c of the third portion of the second adhesivelayer 520 overlapping each of the second pad electrodes 182 is less thanthe thickness T2′ which is before deformation, and the thickness T2 d ofthe fourth portion of the second adhesive layer 520 overlapping a secondopening OP2 between two adjacent second pad electrodes 182 is greaterthan the thickness T2′ which is before deformation. Accordingly, theconnection failure between the first pad part 170 and the lead part 220due to the massing of the conductive balls 414 or the connection failurebetween the second pad part 180 and the bump part 320 due to the massingof the conductive balls 424 may occur.

However, as illustrated in FIGS. 10 and 11 , embodiments of the methodof manufacturing (or providing) the display device 10 may include thepre-pressing step (FIG. 10 ) performed before the main-pressing step. Bythe pre-pressing step, the second adhesive layer 520 may be pre-deformedto have the second thickness T2 (e.g., reduced thickness) that is lessthan the thickness T2′ which is before deformation. That is, the secondadhesive layer 520 which is pre-deformed to have the second thickness T2may provide a pre-pressed display module including a pre-pressedadhesive layer. The method may include providing first pressing of thesecond adhesive layer 520 which has the preliminary thickness to form apre-pressed display module including the first pad part 170.

In an embodiment, in the pre-pressing step, the second area 2A of thedisplay module 20 may be pressed with a second pressure equal to orgreater than the first pressure (e.g., the pressure applied in themain-pressing step). In addition, in the pre-pressing step, the secondarea 2A of the display module 20 may be pressed while heating the secondarea 2A of the display module 20 to a second temperature equal to orgreater than the first temperature (e.g., the temperature of the heatapplied in the main-pressing step). Accordingly, deformation of thesecond adhesive layer 520 which is pre-deformed to have the secondthickness T2 by the pre-pressing step (e.g., pre-deformed adhesivelayer) may be minimal even when the first pressure and heat having thefirst temperature are applied in the main-pressing step performed afterthe pre-pressing step.

In an embodiment, in the pre-pressing step, the second area 2A of thedisplay module 20 may be pressed as a whole, that is, across an entireplanar area of the second area 2A (e.g., planar area defined along thefirst direction DR1 and the second direction DR2). After thepre-pressing step, the second adhesive layer 520 may have asubstantially uniform thickness.

In an embodiment, in the pre-pressing step, only portions of the secondarea 2A of the display module 20 respectively overlapping the first padpart 170 and the second pad part 180 among areas of the second area 2Aof the display module 20 may be selectively pressed. That is, thepre-pressing step may be selectively performed on a planar area to whichpressure and heat are applied in the main-pressing step performed later.In an embodiment, the pre-pressing step (e.g., first pressing) may beselectively performed at areas corresponding to the first pad part 170and the second pad part 180 among areas of the second area 2A of thedisplay module 20. As being selectively pressed, the first pressing mayinclude pressing only a portion of the second adhesive layer 520 whichcorresponds to the first pad part 170 of the display panel 100.

In an embodiment, as illustrated in FIG. 11 , a portion of the secondadhesive layer 520 may protrude outwardly from the second lower film 620by the pre-pressing step. That is, the second adhesive layer 520 mayinclude a protrusion protruding outwardly from the second lower film620. In an embodiment, for example, the protrusion may surround thesecond lower film 620 in a plan view.

In an embodiment, for example, the first side surface 520 a of thesecond adhesive layer 520 may protrude from the first side surface 620 aof the second lower film 620 in the direction opposite to the firstdirection DR1. The first side surface 520 a of the second adhesive layer520 may be curved. In addition, the second side surface 520 b of thesecond adhesive layer 520 may protrude from the second side surface 620b of the second lower film 620 in the first direction DR1. The secondside surface 520 b of the second adhesive layer 520 may be curved.

Referring to FIG. 12 , in an embodiment, at least a portion of theprotrusion of the second adhesive layer 520 may be removed (e.g., may becut).

In an embodiment, for example, a portion of the protrusion that does notoverlap the display panel 100 in a plan view (e.g., a portion protrudingfrom the second lower film 620 in the first direction DR1, the seconddirection DR2, or a direction opposite to the second direction DR2) maybe removed. Accordingly, the second side surface 520 b of the secondadhesive layer 520 may be aligned with the second side surface 620 b ofthe second lower film 620. The second side surface 520 b of the secondadhesive layer 520 may each be flat so as to be coplanar with eachother.

A portion of the protrusion that overlaps the display panel 100 in aplan view (e.g., a portion protruding from the second lower film 620 inthe direction opposite to the first direction DR1) may not be removed.Accordingly, the first side surface 520 a of the second adhesive layer520 may remain protruded from the first side surface 620 a of the secondlower film 620 in the direction opposite to the first direction DR1. Thefirst side surface 520 a of the second adhesive layer 520 may be curved.

When the main-pressing step is performed without the pre-pressing step,as the second adhesive layer 520 is deformed after the main-pressingstep, a portion of the second adhesive layer 520 may protrude outwardlyfrom the second lower film 620. In this case, it may be difficult toremove the protrusion of the second adhesive layer 520 due to thecircuit board 200 attached on the display panel 100.

However, one or more embodiment of the method of manufacturing orproviding the display device 10 may include the pre-pressing stepperformed before the main-pressing step. Accordingly, as the secondadhesive layer 520 is pre-deformed after the pre-pressing step (e.g.,before the circuit board 200 is attached on the display panel 100), aportion of the second adhesive layer 520 may protrude outwardly from thesecond lower film 620 and be exposed to outside the display module 20.Accordingly, the protrusion of the second adhesive layer 520 may beeasily removed. Accordingly, a defect of the display device 10 due tothe protrusion may be prevented or reduced. Accordingly, the reliabilityof the display device 10 may be improved.

Referring to FIG. 13 , the circuit board 200 and the driving circuitchip 300 may be attached to the second area 2A of the display module 20.

The first conductive film 410 and the second conductive film 420 may beattached on the second area 2A of the display module 20. Subsequently,the driving circuit chip 300 may be placed on the second conductive film420 such that the bump part 320 overlaps the second pad part 180, andthe circuit board 200 may be placed on the first conductive film 410such that the lead part 220 overlaps the first pad part 170.

In an embodiment, the driving circuit chip 300 may be placed on thesecond conductive film 420 such that the bump part 320 overlaps thesecond pad part 180 in consideration of an elongation of the displaypanel 100 by the pre-pressing step. That is, the driving circuit chip300 may be placed on the second conductive film 420 such that the bumppart 320 overlaps the second pad part 180 of the display panel 100 whichis unbent or flat. In addition, the circuit board 200 may be placed onthe first conductive film 410 such that the lead part 220 overlaps thefirst pad part 170 in consideration of the elongation of the displaypanel 100 by the pre-pressing step. That is, the display panel 100 isbendable, the pre-pressed display module further includes the displaypanel 100 which is unbent, and the providing of the circuit board 200includes disposing the lead part 220 facing the first pad part 170 ofthe display panel 100 which is unbent. As such, each of the drivingcircuit chip 300 and the circuit board 200 may be attached on thedisplay panel 100 to be more precisely aligned. Accordingly, aconnection failure between the first pad part 170 and the lead part 220due to misalignment between the first pad part 170 and the lead part 220or a connection failure between the second pad part 180 and the bumppart 320 due to misalignment between the second pad part 180 and thebump part 320 may be prevented or reduced. Accordingly, the reliabilityof the display device 10 may be improved.

In the main-pressing step, the driving circuit chip 300 and the circuitboard 200 may be respectively main-pressed with the first pressure usingpressing devices 820 and 830. In an embodiment, when the film layers 412and 422 include a thermo-curable resin, in the main-pressing step, thecircuit board 200 and the driving circuit chip 300 may be respectivelymain-pressed while heating the second area 2A of the display module 20to the first temperature. With respect to the pressing devices 820 and830, for example, the method may include providing second pressing ofthe second adhesive layer 520 to electrically connect the first pad part170 of the display panel 100 to the lead part 220 of the circuit board200 by the first conductive film 410 and providing third pressing of thesecond adhesive layer 520 to electrically connect the second pad part180 of the display panel 100 to the bump part 320 of the driving circuitchip 300 by the second conductive film 420.

The first pressure may be equal to or less than the second pressure, andthe first temperature may be equal to or less than the secondtemperature. That is, the second pressing may include pressing thesecond adhesive layer 520 together with heating the pad area of thedisplay module 20 to a first temperature, and the first pressing mayinclude pressing the second adhesive layer 520 together with heating thepad area of the display module 20 to a second temperature equal to orgreater than the first temperature. Accordingly, the second adhesivelayer 520 pre-deformed to have the second thickness T2 by thepre-pressing step may be hardly deformed even when the first pressureand heat having the first temperature are applied in the main-pressingstep performed after the pre-pressing step. That is, the second pressingof the second adhesive layer 520 maintains the second adhesive layer 520having the second thickness T2 and the third pressing of the secondadhesive layer 520 maintains the second adhesive layer 520 having thesecond thickness T2. Accordingly, after the main-pressing step, thesecond adhesive layer 520 may have a substantially uniform thickness.Accordingly, the connection failure between the first pad part 170 andthe lead part 220 due to the massing of the conductive balls 414 or theconnection failure between the second pad part 180 and the bump part 320due to the massing of the conductive balls 424 may be prevented orreduced. Accordingly, the reliability of the display device 10 may beimproved.

In an embodiment, the circuit board 200 may be attached on the displaypanel 100 after the driving circuit chip 300 is attached. That is, thedriving circuit chip 300 may be placed on the second conductive film420, and the driving circuit chip 300 may be main-pressed with the firstpressure using the pressing device 820 to electrically connecting thesecond pad part 180 and the bump part 320. Subsequently, the circuitboard 200 may be placed on the first conductive film 410, and thecircuit board 200 may be main-pressed with the first pressure using thepressing device 830 to electrically connecting the first pad part 170and the lead part 220.

In an embodiment, the circuit board 200 may be substantiallysimultaneously (or concurrently) attached on the display panel 100 withthe driving circuit chip 300.

Referring to FIGS. 14 and 15 , the third lower film 630 and the thirdadhesive layer 530 may be separated from the first lower film 610 andthe second lower film 620 to define the display module 20 having thecircuit board 200 and the driving circuit chip 300 attached to thedisplay panel 100 at the distal end thereof. The display device 10 (andthe display panel 100) may be bendable at the bending area BA. Thedisplay panel 100 may be bent at the bending area BA. The bending areaBA of the display panel 100 may be bent along the bending axis extendingin the second direction DR2.

In embodiments, the method of manufacturing or providing the displaydevice 10 may include the pre-pressing step performed before themain-pressing step. In the pre-pressing step, the second pressure equalto or greater than the first pressure applied to the display module 20in the main-pressing step and the heat having the second temperatureequal to or greater than the first temperature applied to the displaymodule 20 in the main-pressing step may be applied to the display module20. Accordingly, the second adhesive layer 520 pre-deformed to have thesecond thickness T2 by the pre-pressing step may be hardly deformed evenwhen the first pressure and heat having the first temperature areapplied in the main-pressing step performed after the pre-pressing step.Accordingly, after the main-pressing step, the second adhesive layer 520may have a substantially uniform thickness. Accordingly, the connectionfailure between the first pad part 170 and the lead part 220 due to themassing of the conductive balls 414 or the connection failure betweenthe second pad part 180 and the bump part 320 due to the massing of theconductive balls 424 may be prevented or reduced. Accordingly, thereliability of the display device 10 may be improved.

In embodiments, as the second adhesive layer 520 is pre-deformed afterthe pre-pressing step (e.g., before the circuit board 200 is attached tothe display panel 100), a portion of the second adhesive layer 520 mayprotrude outwardly from the second lower film 620. Accordingly, theprotrusion of the second adhesive layer 520 may be easily removed sincethe circuit board 200 is not attached to the display panel 100.Accordingly, the defect of the display device 10 due to the protrusionmay be prevented or reduced. Accordingly, the reliability of the displaydevice 10 may be improved.

In embodiments, the driving circuit chip 300 may be placed on the secondconductive film 420 such that the bump part 320 overlaps the second padpart 180 in consideration of the elongation of the display panel 100 bythe pre-pressing step. In addition, the circuit board 200 may be placedon the first conductive film 410 such that the lead part 220 overlapsthe first pad part 170 in consideration of the elongation of the displaypanel 100 by the pre-pressing step. That is, each of the driving circuitchip 300 and the circuit board 200 may be attached on the display panel100 to be more precisely aligned. Accordingly, a connection failurebetween the first pad part 170 and the lead part 220 due to misalignmentbetween the first pad part 170 and the lead part 220 or a connectionfailure between the second pad part 180 and the bump part 320 due tomisalignment between the second pad part 180 and the bump part 320 maybe prevented or reduced. Accordingly, the reliability of the displaydevice 10 may be improved.

FIG. 16 is a block diagram illustrating an embodiment of an electronicdevice 900. FIG. 17 is a diagram illustrating an example in which theelectronic device 900 of FIG. 16 is implemented as a television. FIG. 18is a diagram illustrating an example in which the electronic device 900of FIG. 16 is implemented as a smart phone.

Referring to FIGS. 16 to 18 , in an embodiment, an electronic device 900may include a processor 910, a memory device 920, a storage device 930,an input/output (“I/O”) device 940, a power supply 950, and a displaydevice 960. Here, the display device 960 may correspond to one or moreembodiment of the display device 10 described with reference to FIGS. 1to 9 . The electronic device 900 may further include a plurality ofports for communicating with a video card, a sound card, a memory card,a universal serial bus (“USB”) device, or the like. In an embodiment, asillustrated in FIG. 17 , the electronic device 900 may be implemented asa television. In an embodiment, as illustrated in FIG. 18 , theelectronic device 900 may be implemented as a smart phone. However,embodiments are not limited thereto, and the electronic device 900 maybe implemented as a cellular phone, a video phone, a smart pad, a smartwatch, a tablet personal computer (“PC”), a car navigation system, acomputer monitor, a laptop, a head disposed (e.g., mounted) display(“HMD”), or the like.

The processor 910 may perform various computing functions. In anembodiment, the processor 910 may be a microprocessor, a centralprocessing unit (“CPU”), an application processor (“AP”), or the like.The processor 910 may be coupled to other components via an address bus,a control bus, a data bus, or the like. In an embodiment, the processor910 may be coupled to an extended bus such as a peripheral componentinterconnection (“PCI”) bus.

The memory device 920 may store data for operations of the electronicdevice 900. In an embodiment, the memory device 920 may include at leastone non-volatile memory device such as an erasable programmableread-only memory (“EPROM”) device, an electrically erasable programmableread-only memory (“EEPROM”) device, a flash memory device, a phasechange random access memory (“PRAM”) device, a resistance random accessmemory (“RRAM”) device, a nano floating gate memory (“NFGM”) device, apolymer random access memory (“PoRAM”) device, a magnetic random accessmemory (“MRAM”) device, a ferroelectric random access memory (“FRAM”)device, or the like, and/or at least one volatile memory device such asa dynamic random access memory (“DRAM”) device, a static random accessmemory (“SRAM”) device, a mobile DRAM device, or the like.

In an embodiment, the storage device 930 may include a solid state drive(“SSD”) device, a hard disk drive (“HDD”) device, a CD-ROM device, orthe like. In an embodiment, the I/O device 940 may include an inputdevice such as a keyboard, a keypad, a mouse device, a touchpad, atouch-screen, or the like, and an output device such as a printer, aspeaker, or the like.

The power supply 950 may provide power for operations of the electronicdevice 900. The display device 960 may be coupled to other componentsvia the buses or other communication links. In an embodiment, thedisplay device 960 may be included in the I/O device 940.

Although embodiments and implementations have been described herein,other embodiments and modifications will be apparent from thisdescription. Accordingly, the invention are not limited to suchembodiments, but rather to the broader scope of the appended claims andvarious obvious modifications and equivalent arrangements as would beapparent to a person of ordinary skill in the art.

What is claimed is:
 1. A display device comprising: a display panelincluding a display area, and a pad area including a first pad part; acircuit board connected to the display panel at the pad area, thecircuit board including a lead part overlapping the first pad part ofthe pad area; a first conductive film which is between the display paneland the circuit board and electrically connects the first pad part ofthe pad area and the lead part of the circuit board to each other; afirst lower film attached to the display panel at the display area; asecond lower film attached to the display panel at the pad area; a firstadhesive layer which attaches the first lower film to the display panelat the display area, the first adhesive layer having a first thickness;and a second adhesive layer which attaches the second lower film to thedisplay panel at the pad area, the second adhesive layer having a secondthickness which is less than the first thickness.
 2. The display deviceof claim 1, wherein the second adhesive layer has a uniform thickness.3. The display device of claim 1, wherein the second adhesive layerincludes the same material as the first adhesive layer.
 4. The displaydevice of claim 1, wherein the second lower film is spaced apart fromthe first lower film in a direction along the display panel, the secondlower film including a first side surface adjacent to the first lowerfilm and a second side surface which is opposite to the first sidesurface, and the second adhesive layer is spaced apart from the firstadhesive layer in the direction along the display panel, the secondadhesive layer including a first side surface adjacent to the firstadhesive layer and a second side surface which is opposite to the firstside surface of the second adhesive layer.
 5. The display device ofclaim 4, wherein the second adhesive layer protrudes toward the firstadhesive layer from the first side surface of the second lower film todispose the first side surface of the second adhesive layer spaced apartfrom the first side surface of the second lower film.
 6. The displaydevice of claim 5, wherein the first side surface of the second adhesivelayer is curved.
 7. The display device of claim 4, wherein the secondside surface of the second adhesive layer is aligned with the secondside surface of the second lower film.
 8. The display device of claim 7,wherein the second side surface of the second adhesive layer is flat. 9.The display device of claim 1, further comprising: the pad area of thedisplay panel further including a second pad part which is spaced apartfrom the first pad part, a driving circuit chip connected to the displaypanel at the pad area, the driving circuit chip spaced apart from thecircuit board and including a bump part overlapping the second pad partof the pad area; and a second conductive film which is between thedisplay panel and the driving circuit chip and electrically connects thesecond pad part of the pad area and the bump part of the driving circuitchip to each other.
 10. A method of providing a display device, themethod comprising: providing a display module including: a display panelincluding a display area and a pad area which includes a first pad part,a first lower film attached to the display panel at the display area,and a second lower film attached to the display panel at the pad area, afirst adhesive layer which attaches the first lower film to the displaypanel at the display area, the first adhesive layer having a firstthickness, and a second adhesive layer which attaches the second lowerfilm to the display panel at the pad area, the second adhesive layerhaving a preliminary thickness which is the same as the first thickness;providing first pressing of the second adhesive layer which has thepreliminary thickness to form a pre-pressed display module including thefirst pad part; providing a first conductive film on the first pad partof the pre-pressed display module; providing a circuit board including alead part facing the first pad part of the pre-pressed display modulewith the first conductive film therebetween; and providing secondpressing of the second adhesive layer to electrically connect the firstpad part of the pre-pressed display module to the lead part of thecircuit board.
 11. The method of claim 10, wherein the first pressing ofthe second adhesive layer which has the preliminary thickness providesthe second adhesive layer having a second thickness which is less thanthe first thickness of the first adhesive layer.
 12. The method of claim11, wherein the second pressing of the second adhesive layer maintainsthe second adhesive layer having the second thickness.
 13. The method ofclaim 12, wherein the second pressing of the second adhesive layerprovides the second adhesive layer having a uniform thickness.
 14. Themethod of claim 12, wherein the display panel of the display modulefurther includes a second pad part spaced apart from the first pad part;the providing of the first pressing of the second adhesive layer formsthe pre-pressed display module further including the second pad part;and the method further comprises: providing a second conductive film onthe second pad part of the pre-pressed display module; providing adriving circuit chip including a bump part facing the second pad part ofthe pre-pressed display module with the second conductive filmtherebetween; and providing third pressing of the second adhesive layerto electrically connect the second pad part of the pre-pressed displaymodule to the bump part of the driving circuit chip.
 15. The method ofclaim 14, wherein the third pressing of the second adhesive layermaintains the second adhesive layer having the second thickness.
 16. Themethod of claim 10, wherein the second pressing includes pressing thesecond adhesive layer with a first pressure, and the first pressingincludes pressing the second adhesive layer with a second pressure equalto or greater than the first pressure.
 17. The method of claim 10,wherein the second pressing includes pressing the second adhesive layertogether with heating the pad area of the display panel to a firsttemperature, and the first pressing includes pressing the secondadhesive layer together with heating the pad area of the display panelto a second temperature equal to or greater than the first temperature.18. The method of claim 10, wherein the providing of the first pressingof the second adhesive layer forms the pre-pressed display modulefurther including a protrusion of the second adhesive layer whichprotrudes from the second lower film; and the method further comprisesremoving at least a portion of the protrusion of the second adhesivelayer.
 19. The method of claim 10, wherein the first pressing includespressing only a portion of the second adhesive layer which correspondsto the first pad part of the display panel.
 20. The method of claim 10,wherein the providing of the circuit board includes disposing thecircuit board in consideration of an elongation of the display panel bythe first pressing.